HOME > Room temperature bonding opens future
- Challenge to Solid state Encapsulation
- OLED is weak to moisture and oxygen is well known. As a measure, putting desiccant inside a cell,, or bonding glasses with glass frit have been taken to be measures. Room temperature bonding is only possible when Si film is coated by spattering on both glass surfaces, and this technology is considered to open the way for OLED encapsulation that is required enlargement. However, it is also true that there are many problems must be solved such as flattening on the wiring layer.
- Bonding between glass and aluminum film.
- Such as OLED of Bottom emission and solar battery, the device side needs to be glass, but the cover side can be moisture proof materials if it works for covering. Room temperature boding has a feature that can easily bond different kind materials; it may also be developed in such purposes.
- Bonding film
- There are big expectations that marketability of flexible devices, like displays and lighting. Especially, many requests for flexible of OLED lighting. There are researches and developments that moisture proof of the film for materials around the world. Thereby, many results have been published, so it confuses people that making practical is close. But bonding between the films is only considered using a conventional adhesive material, we think that this process becomes an issue in making practical. It is possible to be room temperature bonding between the films in theory, we would like to move forward this bonding research. However, the key in this process is also succeeding under ordinary pressure.
- Bonding different kind materials
- Different kind materials for various uses is considered difficult to bond due to differences in expansion coefficient. Room temperature bonding can be bonded different kind materials in principle.
- Expansion coefficient optimization
- When bonding 2 different materials A and B, by the difference in expansion coefficients of both substances AB, it is difficult to bond both materials. In this case, for example, bond a glass behind the material A, possible to change the expansion coefficient. Room temperature bonding is also possible in such uses.
