LANTECHNICAL SERVICE CO., LTD.

2011/5/20

　Press release of a new method of room temperature technology developed by the University of Tokyo and us.

2011/5/30

　Nikkei Japan publication “OLED panel enlargement.”

2011/5/30

The Chemical Daily publication “Room temperature SiO2 wafer bonding.”

2011/05/20

　A new method of room temperature bonding technology developed by the University of Tokyo and us has been published at a press conference.

2011/05/30

　An article of LANTECHNICAL SERVICE published in Nikkei Japan.

2011/05/30

　An article of LANTECHNICAL SERVICE published in The Chemical Daily.

inquire. LANTECHNICAL SERVICE CO., LTD.(representative) TEL 03-3370-3666 FAX 03-3370-4258

LAN TECHNICAL SERVICE CO., LTD.