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- 2011/5/30
- Nikkei Japan publication “OLED panel enlargement.”
- 2011/5/30
- The Chemical Daily publication “Room temperature SiO2 wafer bonding.”
- 2011/5/20
- Press release of a new method of room temperature technology developed by the University of Tokyo and us.
- 2011/04/09
- We will exhibit for FINETECH JAPAN from April 13th -15th in emergency. Main topics is to success Surface Activated Bonding between Glass to Glass .(Room temperature bonding) We want to report that this development mastered epoch-making success.
Also we have very good result to bond different kind materials in Room temperature. - 2011/04/04
- Due to the effect of the earthquake and tsunami of March 11, some of the venues in Tokyo big site have been designated as temporary shelter. In addition, rolling blackouts may be implemented in some areas. Considering these situations, We have decided to forgo our participation in the exhibition; 21st FINETECH JAPAN (13-15th Apr. Tokyo Big Sight, Japan）.
We hereby express our deepest appology to those who have been looking forward to our works. Thank you for your undersatnding and cooperation.
Our representative director Yoshiie Matsumoto's technical seminar is going to be held as scheduled.（14th Apr. 13:30～16:00） - 2009/04/01
- Comprehensive exhibition and forum on Flat Panel Displays
- 2009/03/31
- The WEB site was overall renewed.
